Details
- Status
- Closed
- Publication date
- 14 February 2019
- Opening date
- Deadline model
- Single-stage
- Deadline date
- 14 May 2019, 00:00 (CEST)
- Programme Sector
- Digital
- Programme
- Connecting Europe Facility 1
Description
The 2019 CEF Telecom eProcurement call makes an indicative €1 million of funding available for proposals in this area.
Indicative Call Timeline |
|
Call opening |
4 July 2019 |
Deadline for submission |
Closed on 14 November 2019 |
Evaluation of proposals |
December 2019 - February 2020 |
Consultation of the CEF Committee |
April 2020 |
Information to the European Parliament |
May 2020 |
Adoption of the Selection Decision |
May 2020 |
Preparation and signature of grant agreements | Between May and August 2020 |
List of projects selected for co-funding | Available here |
Work Programme | |
2019 - 2020 CEF Telecom Work Programme |
|
Corrigendum 16 April 2019 | Available here |
Call for Proposals | |
2019 CEF Telecom Call for Proposals – eProcurement | Call text |
Application Forms |
|
Apply online - TENtec eSubmission |
This call is closed |
Application Form Part A For reference only: electronic submission of Part A using the eSubmission module is mandatory |
|
Application Form Part B |
|
Application Form Part C |
|
Application Form Part D |
Guidance Documents |
|
Guide for Applicants |
|
Application checklist | Available here |
Frequently Asked Questions (FAQs) | Available here |
Background Documents & useful info Common to all calls |
|
CEF Digital Single Web Portal | Available here |
CEF Regulation |
|
Telecommunications Regulation |
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EU Financial Regulation |
|
Model Grant Agreement |
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Privacy statement |
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Commission Decision on the reimbursement of personnel costs | |
List of national contact points for CEF Telecom | Available here |
Call specific - eProcurement | |
e-Certis: Specifications for the e-Certis web service |
|
ESPD: The data exchange model |
|
VCD: Information about the Virtual Company Dossier (VCD) |
Available here |
TED: Information how to become an eSender | Available here |